Lam’s photoresist strip and wafer cleaning products provide efficient and effective removal of photoresist, residues, and particles without impacting device features. The extension of our TrueMask WPA solution to include EUV provides mask shops with a new capability to assess the wafer impact from the mask images.
Lam Research Corp. (Nasdaq: LRCX) today announced a dry resist technology for extreme ultraviolet (EUV) patterning. It is a dry deposition technique with alternate compositions and mechanisms. Out of these cookies, the cookies that are categorized as necessary are stored on your browser as they are as essential for the working of basic functionalities of the website. We also use third-party cookies that help us analyze and understand how you use this website. Lam Research (NASDAQ:LRCX) announces a dry resist technology for extreme ultraviolet patterning.
As EUV lithography systems are now being used in high volume manufacturing by leading-edge chipmakers, further improvements to productivity and resolution will help extend affordable scaling to future process nodes. This website uses cookies to improve your experience while you navigate through the website. These cookies will be stored in your browser only with your consent. As we get to 5nm and below, vectorless methodologies become too inaccurate.Hybrid bonding opens up a big improvement in die-to-die performance, but getting there is not trivial.TrueMask WPA enables mask shops to leverage existing CD-SEM equipment to identify mask-level CD uniformity issues that will impact the wafer during subsequent lithography processing in the fab in minutes instead of hours or days as with other approaches.Dry resist technology is a new approach to deposit and develop EUV resists. You also have the option to opt-out of these cookies. “GPU acceleration is particularly useful in simulating the complex interactions of physical effects in semiconductor manufacturing processes, including lithography, in reasonable time. Lam’s dry resist solutions offer significant EUV sensitivity and resolution advantages and thus an improved overall cost for each EUV wafer pass.
Wet processing technologies can be used for wafer cleaning as well as strip and etch applications. The original dry film photoresist invented by DuPont is the industry standard for high yield, productivity, and ease of use in all imaging applications. It is a dry deposition technique with alternate compositions and mechanisms.D2S’s TrueMask WPA technology is a GPU-accelerated aerial simulation tool that integrates with mask CD-SEM systems. They presented on this collaborative effort with ASML and imec yesterday at the SPIE Advanced Lithography conference in San Jose.
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